Empowering innovation through cutting-edge semiconductor solutions.

Transform your semiconductor projects with our industry-leading services, including state-of-the-art SoC Design services, ASIC Design services, and VLSI Design services. Our expert team leverages the latest technologies and innovative strategies to take your concepts to a new level of excellence, ensuring efficient, reliable, and highly integrated semiconductor solutions that meet the demands of today's dynamic markets.

Do it right with Ignitarium.

Architecture Consulting

We understand that market differentiation of a new product is attained not merely by targeting power, performance, area and cost goals but by addressing deeper nuances like security and safety requirements.

From Hardware / Software partitioning of a system to Math / DSP intensive designs, from IP-based to all-scratch ASICs, our architects have delivered numerous production-proven architectural specifications.
Platform SW Driver Development & System...
FuSa Qualification of an Automotive SoC

Digital Design and Verification

A designer knows he has achieved perfection not when there is nothing left to add but when there is nothing left to take away. At Ignitarium, we strive for minimalism-driven designs, squeezing every ounce of performance while staying within the optimal area and power envelope.

These designs are then put through the proverbial wringer by our verification teams, who are armed with system level understanding, advanced verification methodologies and most importantly, rigor and attention to detail.
Lithium Ion Battery Charger Mixed Signal Verification
IoT Gateway Device IC Verification

FPGA Design and Emulation

FPGA Design and Emulation FPGAs are truly the wild card in the hardware engineer’s design pack. Ignitarium has used FPGAs to enable compute intensive low volume system realizations and to create quick prototypes.

We have worked on emulation of complex Multimedia SoCs partitioned across multiple FPGAs. Armed with alliance partnerships of Xilinx and Intel-Altera, we are today a key partner for many a system company in their FPGA based product deployments.
FPGA Emulation for ARM Based Processor
FPGA Emulation of a Quad Core...

AMS Verification

Analog domain is pure black magic while Digital is punishingly feature-complex. Our Mixed signal verification engineers come armed with technical understanding that starts from device physics to digital protocols, and languages and tools from Real number modeling to UVM-based methodologies, which helps them seamlessly scale the challenge of verifying the mystic bridge where Digital and Analog merge.
Lithium Ion Battery Charger Mixed Signal Verification
IoT Gateway Device IC Verification


Offering top-quality and highly-efficient DFT process and methodology with in-depth experience in all EDA tools to enable a design with the highest coverage and lowest test times.

Physical Design

Ownership mode Physical Design from RTL to Power, Performance and Area optimized GDS. Expertise in FinFET-based nanometer-scale technology nodes and industry leading tool flows to bring precision and predictability to your complex physical implementation requirements.


IgniteIC® is a proprietary design and verification methodology that enables a jump start to SoC design and leverages ISO-compliant development process for first-pass silicon success.

The main difference between ASIC (Application-Specific Integrated Circuit) design services and SoC (System-on-Chip) design services lies in their architectures and scope:

ASIC design services:

  1. Customization: ASICs are tailored for a specific application or task. The architecture is highly customized to meet the precise requirements of the intended function, often involving specialized circuits optimized for performance and efficiency.
  2. Dedication: ASICs are designed for a singular purpose, excluding unnecessary components. This dedication to a specific task results in high performance and energy efficiency but limits the chip’s versatility.
  3. Optimization: ASICs prioritize optimization for the targeted application. The design process involves maximizing performance and minimizing power consumption by eliminating non-essential features.

SoC design services:

  1. Integration: SoCs integrate multiple components and functionalities onto a single chip. This includes processors, memory, input/output interfaces, and potentially programmable components. The architecture is more complex to accommodate diverse functions.
  2. Versatility: SoCs are designed to be versatile and applicable to a range of tasks. They can be used in various applications, from consumer electronics like smartphones to embedded systems and IoT devices.
  3. Complexity: SoCs are inherently more complex due to the integration of diverse components. The architecture must support the coexistence of different functionalities, leading to a more intricate design process.
  4. Flexibility: SoCs offer greater flexibility as they can be reprogrammed or configured for different tasks. This flexibility comes at the cost of potentially higher power consumption and a larger footprint compared to dedicated ASICs.

In summary, ASIC design services involves creating custom chips optimized for specific applications, resulting in high performance and efficiency. On the other hand, SoC design services focuses on integrating multiple functions onto a single chip to achieve versatility across a broader range of applications, making the architecture more complex and flexible. The choice between ASIC and SoC depends on the specific requirements of the intended use case.

Semiconductor design services encompass a comprehensive range of offerings aimed at facilitating the creation and development of semiconductor devices. These services play a crucial role in transforming conceptual ideas into tangible and functional integrated circuits. Explore the key components that semiconductor design services include:

  1. Custom IC Design: Semiconductor design services begin with custom IC (Integrated Circuit) design. This involves creating specialized circuits tailored to meet specific application requirements. Designers optimize performance, power efficiency, and functionality during this phase.
  2. ASIC Design: Application-Specific Integrated Circuit (ASIC) design is a significant aspect of semiconductor design services. It involves developing chips that are purpose-built for particular applications. ASIC design ensures optimal performance by customizing the architecture to fulfill specific tasks.
  3. SoC Design: System-on-Chip (SoC) design services focus on integrating multiple components onto a single chip. This approach enhances efficiency by consolidating diverse functionalities such as processors, memory, and peripherals into a unified architecture.
  4. RTL (Register Transfer Level) Design: Semiconductor design services include RTL design, where engineers work at the register transfer level to create a hardware description of the digital circuit. This serves as a crucial step before moving on to the physical design phase.
  5. Physical Design and Layout: The physical design phase involves translating the logical design into an actual physical layout. Semiconductor design services include expertise in floor planning, placement, routing, and optimization to ensure manufacturability and performance.
  6. Verification and Validation: Rigorous verification and validation processes are integral to semiconductor design services. This involves thorough testing and simulation to ensure that the designed circuits meet specifications and perform reliably under various conditions.
  7. Analog/Mixed-Signal Design: For applications involving both analog and digital signals, semiconductor design services include expertise in analog/mixed-signal design. This ensures seamless integration of different signal types within the semiconductor device.
  8. FPGA (Field-Programmable Gate Array) Design: FPGA design services involve creating circuits that can be reprogrammed after manufacturing. This flexibility is valuable for prototyping and applications where adaptability is crucial.
  9. Technology Migration and Upgrades: Semiconductor design services often include support for technology migration and upgrades, allowing existing designs to benefit from advancements in semiconductor manufacturing processes.
  10. Design for Testability (DFT): DFT techniques are employed to enhance the ease of testing during manufacturing. Engineers design the semiconductor device with built-in test structures to identify and isolate faults quickly.

Choosing reliable semiconductor design services is pivotal for achieving successful outcomes in the competitive semiconductor industry. These services provide the expertise and resources necessary to navigate the complexities of designing cutting-edge semiconductor devices.

Turnkey semiconductor design services encompass a comprehensive and end-to-end solution for businesses seeking to develop custom semiconductor devices. These services are designed to manage the entire semiconductor design process, from conceptualization to the delivery of a fully functional integrated circuit.

By opting for turnkey semiconductor design services, businesses can streamline the complex process of semiconductor development. These services provide a one-stop solution, ensuring that clients receive a fully realized and manufacturable semiconductor solution tailored to their specific need

Semiconductor design, also known as VLSI (Very Large-Scale Integration) design, is a complex process involving several stages. Each stage contributes to the creation of intricate integrated circuits that power a myriad of electronic devices.

1. Conceptualization and Specification: The semiconductor design process begins with conceptualization and defining specifications. Engineers work closely with clients to understand the application requirements, performance expectations, and functionalities desired in the semiconductor device.

2. Architectural Design: In the architectural design stage of VLSI design, engineers create a high-level blueprint of the semiconductor device. This involves defining the overall structure, functionality, and interconnections between different components.

3. RTL Design: Register Transfer Level (RTL) design is a crucial phase in semiconductor design. Engineers create a hardware description at the register transfer level, specifying the digital circuit’s behavior and data flow.

4. Functional Verification: Functional verification ensures that the RTL design meets the specified requirements. This stage involves rigorous testing and simulation to identify and rectify any design flaws or discrepancies.

5. Logic Synthesis: Logic synthesis involves converting the RTL description into a netlist, which is a detailed representation of the circuit’s logical components. This stage optimizes the design for factors like performance, power consumption, and area.

6. Physical Design: Physical design encompasses tasks such as floor planning, placement, routing, and optimization. It transforms the logical design into an actual physical layout, considering factors like signal integrity, power distribution, and manufacturability.

7. Timing Analysis: Timing analysis ensures that signals in the semiconductor device meet the required timing constraints. This involves assessing delays and optimizing the design to achieve the desired performance.

8. Design for Testability (DFT): DFT techniques are employed to enhance the ease of testing during manufacturing. Engineers design the semiconductor device with built-in test structures to identify and isolate faults quickly.

9. Verification and Simulation: The design undergoes thorough verification and simulation to confirm its correctness, functionality, and adherence to specifications. This stage ensures the semiconductor device performs as intended under various conditions.

10. Prototyping and FPGA Implementation: Prototyping involves creating a physical prototype of the semiconductor device for testing purposes. FPGA (Field-Programmable Gate Array) implementation may also be utilized for rapid prototyping and validation.

11. Manufacturing and Fabrication: Once the design is verified and validated, it moves to the manufacturing phase. Semiconductor fabrication facilities produce the integrated circuits based on the finalized design.

12. Testing and Quality Assurance: Comprehensive testing is conducted on manufactured semiconductor devices to ensure quality and functionality. This stage involves various tests, including functional testing, performance testing, and reliability testing.

13. Post-Silicon Validation: Post-silicon validation involves testing the semiconductor device in real-world conditions. This stage identifies and addresses any issues that may arise in the actual operating environment.

By navigating through these stages of semiconductor design or VLSI design, engineers can create sophisticated integrated circuits that power the advanced electronic systems prevalent in today’s technology landscape.

In VLSI (Very Large Scale Integration) design services, the design process is typically divided into two main phases: front-end design and back-end design. These phases involve distinct tasks and responsibilities, contributing to the overall creation of integrated circuits.

Front-End Design:

1. Specification and High-Level Design: Front-end design starts with understanding the client’s requirements and creating a high-level design specification. Engineers collaborate to define the overall architecture, functionality, and key components of the integrated circuit.

2. RTL Design: Register Transfer Level (RTL) design is a crucial front-end task. Engineers create a hardware description at the RTL, specifying the digital circuit’s behavior and data flow. This forms the foundation for subsequent stages.

3. Functional Verification: Functional verification in the front-end ensures that the RTL design meets the specified requirements. Engineers conduct thorough testing and simulation to identify and rectify any design flaws or discrepancies before moving forward.

4. Logic Synthesis: Logic synthesis transforms the RTL description into a netlist, optimizing the design for factors such as performance, power consumption, and area. This stage focuses on refining the logical structure of the design.

5. High-Level Testing: High-level testing in the front-end involves validating the overall functionality of the design. It ensures that the initial specifications are met and that the circuit operates as intended at a conceptual level.

Back-End Design:

1. Physical Design: Back-end design deals with the physical implementation of the circuit. Tasks such as floor planning, placement, and routing are performed to create the actual physical layout of the integrated circuit.

2. Timing Analysis: Timing analysis in the back-end ensures that signals in the design meet the required timing constraints. Engineers assess delays and optimize the physical design to achieve the desired performance.

3. Design for Testability (DFT): DFT techniques are applied in the back-end to enhance the ease of testing during manufacturing. Engineers design the circuit with built-in test structures to identify and isolate faults efficiently.

4. Verification and Simulation: Back-end verification and simulation focus on confirming the correctness of the physical design, including factors like signal integrity, power distribution, and manufacturability.

5. Prototyping and FPGA Implementation: Prototyping and FPGA implementation may be part of the back-end process for rapid testing and validation of the physical design before moving to full-scale manufacturing.

6. Manufacturing and Fabrication: The back-end concludes with the manufacturing phase. Semiconductor fabrication facilities produce the integrated circuits based on the finalized physical design.

By understanding the distinctions between front-end and back-end design in VLSI design services, businesses can effectively navigate the complex process of creating advanced integrated circuits. These specialized services cater to different aspects of the design lifecycle, ensuring a comprehensive and efficient approach to VLSI design.

In the realm of VLSI (Very Large Scale Integration) design services, the terms “back-end design” and “physical design” are often used interchangeably, but they do encompass slightly different aspects within the overall design process. Let’s delve into the relationship between back-end design and physical design in VLSI, incorporating the “VLSI design services” keyword for SEO purposes:

Back-End Design in VLSI:

Back-end design in VLSI refers to the phase of the design process that deals with the implementation and realization of the integrated circuit after the front-end design has been completed. It involves translating the logical design created during the front-end phase into an actual physical layout that can be manufactured. Back-end design encompasses several critical tasks, including:

1. Physical Design: Physical design, which is often considered synonymous with back-end design, involves tasks like floor planning, placement, and routing. Engineers determine the precise placement of components on the chip, optimize routing for signal integrity, and create a layout that adheres to the design specifications.

2. Timing Analysis: Timing analysis is performed during the back-end design to ensure that the signals in the physical layout meet the required timing constraints. Engineers evaluate and optimize the circuit to achieve the desired performance levels.

3. Design for Testability (DFT): Back-end design incorporates DFT techniques to enhance the ease of testing during the manufacturing phase. This involves designing the integrated circuit with built-in test structures to identify and isolate faults efficiently.

4. Verification and Simulation: The back-end verification and simulation processes focus on confirming the correctness of the physical design. This includes assessing factors like signal integrity, power distribution, and manufacturability.

Physical Design in VLSI: Physical design, as mentioned earlier, is a component of back-end design. It specifically emphasizes the layout and geometry of the integrated circuit. The physical design stage includes:

1. Floor Planning: Engineers decide on the overall chip floor plan, determining the placement of functional blocks, power grids, and I/O pads.

2. Placement: During the placement stage, the positions of individual components are determined within the chip area, considering factors such as heat dissipation and signal propagation.

3. Routing: Routing involves establishing the interconnections between the placed components. Engineers optimize the routing to ensure efficient signal paths, avoid congestion, and minimize potential issues.

4. Optimization: The physical design undergoes optimization processes to enhance performance, reduce power consumption, and meet design specifications.

In summary, while back-end design and physical design are closely related, with physical design being a significant aspect of the back-end, back-end design as a broader term includes additional considerations like timing analysis, design for testability, and overall verification. Both terms are vital in the comprehensive process of VLSI design services, ensuring the successful transition from a conceptual design to a physically manufacturable integrated circuit.

In the realm of VLSI (Very Large Scale Integration) design services, the verification stage plays a crucial role in ensuring the correctness and functionality of the designed integrated circuits. The verification stage is primarily associated with the front-end of the VLSI design process. Let’s explore the placement of the verification stage in the context of VLSI design services, incorporating the “VLSI design services” keyword for SEO purposes:

Verification Stage in VLSI Design Services:

1. Front-End Focus: The verification stage is predominantly a front-end design activity. It occurs after the Register Transfer Level (RTL) design phase and involves comprehensive testing and simulation to confirm that the design meets the specified requirements and behaves as intended.

2. Functional Verification: Front-end verification primarily focuses on functional verification. Engineers use testbenches, simulations, and other verification methodologies to validate the logical design, ensuring that the implemented RTL accurately reflects the desired behavior.

3. Bug Identification and Correction: During the verification stage, any discrepancies or bugs in the design are identified and corrected. This iterative process helps refine the design before progressing to subsequent phases, reducing the likelihood of issues being carried forward to the back-end.

4. High-Level Testing: High-level testing is an integral part of front-end verification. It involves assessing the overall functionality of the design based on the initial specifications. Ensuring that the design meets the high-level requirements is crucial before moving on to the physical implementation.

5. RTL Simulation: RTL simulation is a key aspect of front-end verification, where engineers simulate the behavior of the digital circuit at the register transfer level. This simulation helps detect and rectify logical errors in the design.

While the verification stage primarily falls within the front-end of VLSI design services, it’s essential to note that verification activities continue to some extent throughout the entire design process. Back-end verification steps may include ensuring the correctness of the physical layout, addressing timing issues, and validating the final implementation.

In summary, the verification stage is a critical component of VLSI design services, with a primary focus on the front-end. It ensures the functional accuracy of the logical design before transitioning to the physical implementation stages, contributing to the overall success of the VLSI design process.

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Human Pose Detection & Classification

Some Buildings in a city


  • Suitable for real time detection on edge devices
  • Detects human pose / key points and recognizes movement / behavior
  • Light weight deep learning models with good accuracy and performance

Target Markets:

  • Patient Monitoring in Hospitals
  • Surveillance
  • Sports/Exercise Pose Estimation
  • Retail Analytics

OCR / Pattern Recognition

Some Buildings in a city

Use cases :

  • Analog dial reading
  • Digital meter reading
  • Label recognition
  • Document OCR

Highlights :

  • Configurable for text or pattern recognition
  • Simultaneous Analog and Digital Dial reading
  • Lightweight implementation

Behavior Monitoring

Some Buildings in a city

Use cases :

  • Fall Detection
  • Social Distancing

Highlights :

  • Can define region of interest to monitor
  • Multi-subject monitoring
  • Multi-camera monitoring
  • Alarm triggers

Attire & PPE Detection

Some Buildings in a city

Use cases :

  • PPE Checks
  • Disallowed attire checks

Use cases :

  • Non-intrusive adherence checks
  • Customizable attire checks
  • Post-deployment trainable


Request for Video

    Real Time Color Detection​

    Use cases :

    • Machine vision applications such as color sorter or food defect detection

    Highlights :

    • Color detection algorithm with real time performance
    • Detects as close to human vison as possible including color shade discrimination
    • GPGPU based algorithm on NVIDIA CUDA and Snapdragon Adreno GPU
    • Extremely low latency (a few 10s of milliseconds) for detection
    • Portable onto different hardware platforms

    Missing Artifact Detection

    Use cases :

    • Detection of missing components during various stages of manufacturing of industrial parts
    • Examples include : missing nuts and bolts, missing ridges, missing grooves on plastic and metal blocks

    Highlights :

    • Custom neural network and algorithms to achieve high accuracy and inference speed
    • Single-pass detection of many categories of missing artifacts
    • In-field trainable neural networks with dynamic addition of new artifact categories
    • Implementation using low cost cameras and not expensive machine-vision cameras
    • Learning via the use of minimal training sets
    • Options to implement the neural network on GPU or CPU based systems

    Real Time Manufacturing Line Inspection

    Use cases :

    • Detection of defects on the surface of manufactured goods (metal, plastic, glass, food, etc.)
    • Can be integrated into the overall automated QA infrastructure on an assembly line.

    Highlights :

    • Custom neural network and algorithms to achieve high accuracy and inference speed
    • Use of consumer or industrial grade cameras
    • Requires only a few hundred images during the training phase
    • Supports incremental training of the neural network with data augmentation
    • Allows implementation on low cost GPU or CPU based platforms

    Ground Based Infrastructure analytics

    Some Buildings in a city

    Use cases :

    • Rail tracks (public transport, mining, etc.)
    • Highways
    • Tunnels

    Highlights :

    • Analysis of video and images from 2D & 3D RGB camera sensors
    • Multi sensor support (X-ray, thermal, radar, etc.)
    • Detection of anomalies in peripheral areas of core infrastructure (Ex: vegetation or stones near rail tracks)

    Aerial Analytics

    Use cases :

    • Rail track defect detection
    • Tower defect detection: Structural analysis of Power
      transmission towers
    • infrastructure mapping

    Highlights :

    • Defect detection from a distance
    • Non-intrusive
    • Automatic video capture with perfectly centered ROI
    • No manual intervention is required by a pilot for
      camera positioning


    Co-founder & CEO


    Founder and Managing director of Ignitarium, Sanjay has been responsible for defining Ignitarium’s core values, which encompass the organisation’s approach towards clients, partners, and all internal stakeholders, and in establishing an innovation and value-driven organisational culture.


    Prior to founding Ignitarium in 2012, Sanjay spent the initial 22 years of his career with the VLSI and Systems Business unit at Wipro Technologies. In his formative years, Sanjay worked in diverse engineering roles in Electronic hardware design, ASIC design, and custom library development. Sanjay later handled a flagship – multi-million dollar, 600-engineer strong – Semiconductor & Embedded account owning complete Delivery and Business responsibility.


    Sanjay graduated in Electronics and Communication Engineering from College of Engineering, Trivandrum, and has a Postgraduate degree in Microelectronics from BITS Pilani.


    Request Free Demo

      RAMESH EMANI Board Member


      Board Member

      Ramesh was the Founder and CEO of Insta Health Solutions, a software products company focused on providing complete hospital and clinic management solutions for hospitals and clinics in India, the Middle East, Southeast Asia, and Africa. He raised Series A funds from Inventus Capital and then subsequently sold the company to Practo Technologies, India. Post-sale, he held the role of SVP and Head of the Insta BU for 4 years. He has now retired from full-time employment and is working as a consultant and board member.


      Prior to Insta, Ramesh had a 25-year-long career at Wipro Technologies where he was the President of the $1B Telecom and Product Engineering Solutions business heading a team of 19,000 people with a truly global operations footprint. Among his other key roles at Wipro, he was a member of Wipro's Corporate Executive Council and was Chief Technology Officer.


      Ramesh is also an Independent Board Member of eMIDs Technologies, a $100M IT services company focused on the healthcare vertical with market presence in the US and India.


      Ramesh holds an M-Tech in Computer Science from IIT-Kanpur.


      General Manager - Marketing

      A professional with a 14-year track record in technology marketing, Malavika heads marketing in Ignitarium. Responsible for all branding, positioning and promotional initiatives in the company, she has collaborated with technical and business teams to further strengthen Ignitarium's positioning as a key E R&D services player in the ecosystem.

      Prior to Ignitarium, Malavika has worked in with multiple global tech startups and IT consulting companies as a marketing consultant. Earlier, she headed marketing for the Semiconductor & Systems BU at Wipro Technologies and worked at IBM in their application software division.

      Malavika completed her MBA in Marketing from SCMHRD, Pune, and holds a B.E. degree in Telecommunications from RVCE, Bengaluru.



      VP - Operations

      Pradeep comes with an overall experience of 26 years across IT services and Academia. In his previous role at Virtusa, he played the role of Delivery Leader for the Middle East geography. He has handled complex delivery projects including the transition of large engagements, account management, and setting up new delivery centers.

      Pradeep graduated in Industrial Engineering and Management, went on to secure an MBA from CUSAT, and cleared UGN Net in Management. He also had teaching stints at his alma mater, CUSAT, and other management institutes like DCSMAT. A certified P3O (Portfolio, Program & Project Management) from the Office of Government Commerce, UK, Pradeep has been recognized for key contributions in the Management domain, at his previous organizations, Wipro & Virtusa.

      In his role as the Head of Operations at Ignitarium, Pradeep leads and manages operational functions such as Resource Management, Procurement, Facilities, IT Infrastructure, and Program Management office.


      SONA MATHEW Director – Human Resources


      AVP – Human Resources

      Sona heads Human Resource functions - Employee Engagement, HR Operations and Learning & Development – at Ignitarium. Her expertise include deep and broad experience in strategic people initiatives, performance management, talent transformation, talent acquisition, people engagement & compliance in the Information Technology & Services industry.


      Prior to Ignitarium, Sona has had held diverse HR responsibilities at Litmus7, Cognizant and Wipro.


      Sona graduated in Commerce from St. Xaviers College and did her MBA in HR from PSG College of Technology.



      Vice President - Sales

      As VP of Sales, Ashwin is responsible for Ignitarium’s go-to-market strategy, business, client relationships, and customer success in the Americas. He brings in over a couple of decades of experience, mainly in the product engineering space with customers from a wide spectrum of industries, especially in the Hi-Tech/semiconductor and telecom verticals.


      Ashwin has worked with the likes of Wipro, GlobalLogic, and Mastek, wherein unconventional and creative business models were used to bring in non-linear revenue. He has strategically diversified, de-risked, and grown his portfolios during his sales career.


      Ashwin strongly believes in the customer-first approach and works to add value and enhance the experiences of our customers.


      AZIF SALY Director – Sales


      Vice President – Sales & Business Development

      Azif is responsible for go-to-market strategy, business development and sales at Ignitarium. Azif has over 14 years of cross-functional experience in the semiconductor product & service spaces and has held senior positions in global client management, strategic account management and business development. An IIM-K alumnus, he has been associated with Wipro, Nokia and Sankalp in the past.


      Azif handled key accounts and sales process initiatives at Sankalp Semiconductors. Azif has pursued entrepreneurial interests in the past and was associated with multiple start-ups in various executive roles. His start-up was successful in raising seed funds from Nokia, India. During his tenure at Nokia, he played a key role in driving product evangelism and customer success functions for the multimedia division.


      At Wipro, he was involved in customer engagement with global customers in APAC and US.


      RAJU KUNNATH Vice President – Enterprise & Mobility


      Distinguished Engineer – Digital

      At Ignitarium, Raju's charter is to architect world class Digital solutions at the confluence of Edge, Cloud and Analytics. Raju has over 25 years of experience in the field of Telecom, Mobility and Cloud. Prior to Ignitarium, he worked at Nokia India Pvt. Ltd. and Sasken Communication Technologies in various leadership positions and was responsible for the delivery of various developer platforms and products.


      Raju graduated in Electronics Engineering from Model Engineering College, Cochin and has an Executive Post Graduate Program (EPGP) in Strategy and Finance from IIM Kozhikode.


      PRADEEP SUKUMARAN Vice President – Business Strategy & Marketing


      Vice President - Software Engineering

      Pradeep heads the Software Engineering division, with a charter to build and grow a world-beating delivery team. He is responsible for all the software functions, which includes embedded & automotive software, multimedia, and AI & Digital services

      At Ignitarium, he was previously part of the sales and marketing team with a special focus on generating a sales pipeline for Vision Intelligence products and services, working with worldwide field sales & partner ecosystems in the U.S  Europe, and APAC.

      Prior to joining Ignitarium in 2017, Pradeep was Senior Solutions Architect at Open-Silicon, an ASIC design house. At Open-Silicon, where he spent a good five years, Pradeep was responsible for Front-end, FPGA, and embedded SW business development, marketing & technical sales and also drove the IoT R&D roadmap. Pradeep started his professional career in 2000 at Sasken, where he worked for 11 years, primarily as an embedded multimedia expert, and then went on to lead the Multimedia software IP team.

      Pradeep is a graduate in Electronics & Communication from RVCE, Bangalore.


      SUJEET SREENIVASAN Vice President – Embedded


      Vice President – Automotive Technology


      Sujeet is responsible for driving innovation in Automotive software, identifying Automotive technology trends and advancements, evaluating their potential impact, and development of solutions to meet the needs of our Automotive customers.

      At Ignitarium, he was previously responsible for the growth and P&L of the Embedded Business unit focusing on Multimedia, Automotive, and Platform software.

      Prior to joining Ignitarium in 2016, Sujeet has had a career spanning more than 16 years at Wipro. During this stint, he has played diverse roles from Solution Architect to Presales Lead covering various domains. His technical expertise lies in the areas of Telecom, Embedded Systems, Wireless, Networking, SoC modeling, and Automotive. He has been honored as a Distinguished Member of the Technical Staff at Wipro and has multiple patents granted in the areas of Networking and IoT Security.

      Sujeet holds a degree in Computer Science from Government Engineering College, Thrissur.


      RAJIN RAVIMONY Distinguished Engineer


      Distinguished Engineer


      At Ignitarium, Rajin plays the role of Distinguished Engineer for complex SoCs and systems. He's an expert in ARM-based designs having architected more than a dozen SoCs and played hands-on design roles in several tens more. His core areas of specialization include security and functional safety architecture (IEC61508 and ISO26262) of automotive systems, RTL implementation of math intensive signal processing blocks as well as design of video processing and related multimedia blocks.


      Prior to Ignitarium, Rajin worked at Wipro Technologies for 14 years where he held roles of architect and consultant for several VLSI designs in the automotive and consumer domains.


      Rajin holds an MS in Micro-electronics from BITS Pilani.


      SIBY ABRAHAM Executive Vice President, Strategy


      Executive Vice President, Strategy


      As EVP, of Strategy at Ignitarium, Siby anchors multiple functions spanning investor community relations, business growth, technology initiatives as well and operational excellence.


      Siby has over 31 years of experience in the semiconductor industry. In his last role at Wipro Technologies, he headed the Semiconductor Industry Practice Group where he was responsible for business growth and engineering delivery for all of Wipro’s semiconductor customers. Prior to that, he held a vast array of crucial roles at Wipro including Chief Technologist & Vice President, CTO Office, Global Delivery Head for Product Engineering Services, Business Head of Semiconductor & Consumer Electronics, and Head of Unified Competency Framework. He was instrumental in growing Wipro’s semiconductor business to over $100 million within 5 years and turning around its Consumer Electronics business in less than 2 years. In addition, he was the Engineering Manager for Enthink Inc., a semiconductor IP-focused subsidiary of Wipro. Prior to that, Siby was the Technical Lead for several of the most prestigious system engineering projects executed by Wipro R&D.


      Siby has held a host of deeply impactful positions, which included representing Wipro in various World Economic Forum working groups on Industrial IOT and as a member of IEEE’s IOT Steering Committee.


      He completed his MTech. in Electrical Engineering (Information and Control) from IIT, Kanpur and his BTech. from NIT, Calicut


      SUJEETH JOSEPH Chief Product Officer


      Chief Technology Officer


      As CTO, Sujeeth is responsible for defining the technology roadmap, driving IP & solution development, and transitioning these technology components into practically deployable product engineering use cases.


      With a career spanning over 30+ years, Sujeeth Joseph is a semiconductor industry veteran in the SoC, System and Product architecture space. At SanDisk India, he was Director of Architecture for the USD $2B Removable Products Group. Simultaneously, he also headed the SanDisk India Patenting function, the Retail Competitive Analysis Group and drove academic research programs with premier Indian academic Institutes. Prior to SanDisk, he was Chief Architect of the Semiconductor & Systems BU (SnS) of Wipro Technologies. Over a 19-year career at Wipro, he has played hands-on and leadership roles across all phases of the ASIC and System design flow.


      He graduated in Electronics Engineering from Bombay University in 1991.


      SUJITH MATHEW IYPE Co-founder & CTO


      Co-founder & COO


      As Ignitarium's Co-founder and COO, Sujith is responsible for driving the operational efficiency and streamlining process across the organization. He is also responsible for the growth and P&L of the Semiconductor Business Unit.


      Apart from establishing a compelling story in VLSI, Sujith was responsible for Ignitarium's foray into nascent technology areas like AI, ML, Computer Vision, and IoT, nurturing them in our R&D Lab - "The Crucible".


      Prior to founding Ignitarium, Sujith played the role of a VLSI architect at Wipro Technologies for 13 years. In true hands-on mode, he has built ASICs and FPGAs for the Multimedia, Telecommunication, and Healthcare domains and has provided technical leadership for many flagship projects executed by Wipro.


      Sujith graduated from NIT - Calicut in the year 2000 in Electronics and Communications Engineering and thereafter he has successfully completed a one-year executive program in Business Management from IIM Calcutta.


      RAMESH SHANMUGHAM Co-founder & COO


      Co-founder & CRO

      As Co-founder and Chief Revenue Officer of Ignitarium, Ramesh has been responsible for global business and marketing as well as building trusted customer relationships upholding the company's core values.

      Ramesh has over 25 years of experience in the Semiconductor Industry covering all aspects of IC design. Prior to Ignitarium, Ramesh was a key member of the senior management team of the semiconductor division at Wipro Technologies. Ramesh has played key roles in Semiconductor Delivery and Pre-sales at a global level.

      Ramesh graduated in Electronics Engineering from Model Engineering College, Cochin, and has a Postgraduate degree in Microelectronics from BITS Pilani.