Understanding Security and Safety in Modern SoC Designs Part 1
System-on-Chip (SoC) technologies have revolutionised modern electronics by integrating diverse functions, such as CPUs, GPUs, AI engines, and communication modules, into a single chip.

Understanding Security and Safety in Modern SoC Designs | Part 1

System-on-Chip (SoC) technologies have revolutionised modern electronics by integrating diverse functions, such as CPUs, GPUs, AI engines, and communication modules, into a single chip. These chips now power everything from mobile phones to automotive safety systems. However, this high degree of integration also exposes SoCs to a broader range of security vulnerabilities and safety risks. Addressing both functional security (against malicious attacks) and functional safety (against accidental faults) is now a cornerstone of reliable and resilient SoC design.

In this blog series, we will explore:

  •  Mapping Trust in the SoC Lifecycle — Where to Focus Security Efforts
  •  The growing attack surface of SoCs
  • Threats like Hardware Trojans
  •  Understanding Side-Channel Attacks in SoCs
  •  Comparing Surface-Level Attacks and Side-Channel Attacks in SoCs
  •  Security Mechanisms for Surface-Level Attack Prevention
  •  Understanding Hardware Trojans in SoCs
  •  Analog and Mixed-Signal Security Challenges
  •  Detection and Mitigation Strategies in SoCs
  •  RISC-V vs. CISC: Security and Safety Considerations
  •  Functional Safety and Security in SoCs
  •  Role of Verification Engineers in SoC Security
  •  Case Studies: Security-Centric IPs in SoCs
  •  SoC Boot Flow and Anti-Reverse Engineering Measures
  •  Security Breaches in SoCs: Real Incidents
  •  Future Trends in SoC Security and Safety

     

Let’s begin our deep dive into securing the foundations of smart systems.

1. Mapping Trust in the SoC Lifecycle — Where to Focus Security Efforts

Modern SoC designs involve multiple stages, each with different levels of exposure to potential tampering or malicious modification. According to the MDPI survey on Hardware Trojans, evaluating the credibility or trustworthiness of each stage in the chip development lifecycle is essential to identifying where the greatest security risks lie.

The process begins with the specification stage, where the intended behaviour and performance of the chip are defined. This phase is considered trustworthy because it does not involve any direct implementation or manipulation of the hardware. Similarly, the final testing and market release stages are also viewed as trusted because they involve verifying chip functionality and packaging the final product, without the authority to modify the hardware design.

In contrast, the design and synthesis stages are marked as semi-trusted or untrusted. These phases often involve using third-party Intellectual Property (IP) cores, external Electronic Design Automation (EDA) tools, and pre-built standard cells. Each of these components introduces the possibility of backdoors or hidden logic being inserted into the chip. Because these tools and IPs may come from different vendors worldwide, it’s difficult to verify their integrity fully.

Even more critical is the fabrication stage, where the chip design is transformed into a physical product. This step involves generating photomasks, wafer fabrication, and die packaging—all of which can be outsourced to foundries in different geographic regions. These foundries may not be under the direct control of the chip designers, which creates a serious vulnerability. Suppose any part of the fabrication process is compromised. In that case, malicious modifications such as Hardware Trojans can be embedded at a level that is nearly impossible to detect using traditional post-manufacturing tests.

To visualise this concept, the MDPI paper categorises the lifecycle stages using a colour-coded model:

  • Green (Trusted): Specification, final verification, and post-silicon testing.
  • Yellow (Partially Trusted): IP sourcing, EDA tools, and logic synthesis—stages where the design can still be modified, but with some oversight.
  • Red (Untrusted): Mask generation, fabrication, and packaging—these phases have the most authority and lowest transparency, making them the most vulnerable.

This layered trust model helps SoC developers focus their security efforts effectively. For example, advanced verification techniques, such as formal analysis and golden model comparison, should be heavily applied during design and synthesis. Likewise, supply chain validation, secure foundry partnerships, and chip fingerprinting may be essential at the fabrication level.

Understanding which stages of the chip lifecycle can and cannot be trusted allows developers to plan better defences and reduce the risk of malicious interference. This approach is not only useful for building secure hardware, it is critical for ensuring long-term credibility in high-stakes applications like defence, healthcare, and autonomous vehicles.

Modern SoCs are rarely developed entirely in one place. A single chip might be designed in the United States, fabricated in Taiwan, assembled in Malaysia, and tested in China. Along the way, it may incorporate third-party IPs, EDA tools, standard cells, and testing services from vendors all over the world. This opens the door for various threats, such as:

  • Hardware Trojans inserted during design or fabrication
  • Counterfeit chips or components
  • Modified test or packaging processes
  • Leakage of sensitive IP or design data

Trust Models Across Lifecycle Stages: To manage these risks, developers use trust models that classify each stage of the IC lifecycle based on its level of control and risk. For example:

  1. Trusted stages like specification definition and final testing are considered low risk because they do not modify the chip’s internal structure.
  2. Semi-trusted stages like IP integration and EDA tool use have a moderate risk because they influence design, but may still be reviewed.
  3. Untrusted stages like fabrication and packaging are high risk, especially when outsourced, because malicious changes can be made at the physical level.

Understanding which stages are most vulnerable helps guide security investments and testing efforts.

  • Hardware Fingerprinting and Authentication: To verify that a chip hasn’t been tampered with or swapped for a counterfeit, techniques like hardware fingerprinting are used. Every chip has slight variations due to manufacturing imperfections. These tiny differences can be measured and used as a kind of digital “fingerprint” for authentication. This ensures that only genuine and authorised chips are used in secure systems.

  • Blockchain and Secure Provenance: Blockchain technology is also being explored to track the provenance (origin and journey) of chips through the supply chain. Each transaction or movement of the chip—from factory to shipping to deployment—can be recorded on a tamper-proof blockchain ledger. This improves transparency, helps detect tampering, and builds trust between partners.

  • Tamper Detection and Self-Destruction Logic: Some chips are built with tamper detection circuits that can sense when someone is trying to physically probe or alter them. These sensors monitor voltage levels, temperature, or package opening. If tampering is detected, the chip can activate a response such as erasing secure keys, disabling critical functions, or even self-destructing certain internal elements to prevent information theft.

In summary, securing the supply chain is just as important as securing the chip itself. By using a combination of risk modelling, fingerprinting, tamper detection, and emerging technologies like blockchain, designers can ensure that every chip in the field is both genuine and secure.

2. SoC Complexity and the Role of IPs in Security

Modern SoCs integrate a vast range of IP cores, including CPU/GPU cores, memory interfaces, AI accelerators, DSPs, security modules, and more. This diversity adds design complexity, especially when handling third-party IPs, customising cores for application-specific needs, ensuring reliable interaction between blocks, and securing the entire system from potential threats. Managing third-party IPs from various vendors can be challenging because each vendor may follow different design and security practices. Some IPs might be well-tested and documented, while others may lack transparency or adequate support. Integrating these IPs into a single cohesive SoC requires extra effort to validate compatibility and trustworthiness. Customising IPs for specific applications is often necessary to meet unique requirements, such as performance tuning in automotive chips or power-saving in wearable devices. However, customisation introduces risks, as modifications can introduce unforeseen bugs or make future maintenance harder. It also demands additional engineering time and resources. Verifying interactions across hundreds of blocks is complex because even if each IP core functions correctly on its own, unexpected issues can arise when they interact. Timing mismatches, data corruption, or protocol mismatches can cause failures that are difficult to debug. Comprehensive verification requires the use of sophisticated simulation, emulation, and formal methods. Securing the SoC against untrusted components is crucial, especially when incorporating third-party IPs or outsourcing parts of the design. Malicious modifications (e.g., hardware Trojans) can be introduced during integration. Designers must ensure that each IP is validated for integrity, and security boundaries are enforced at both the hardware and software levels.

Key Challenges:
  • Interconnect Complexity: With numerous cores communicating simultaneously over shared buses or networks-on-chip (NoCs), ensuring efficient, reliable, and secure data flow becomes a massive task. Poorly managed interconnects can become bottlenecks or security vulnerabilities.
  • Customisation Tradeoffs (Power, Performance, Area): Optimising the SoC for power, performance, and area often involves tradeoffs. Enhancing one aspect might compromise another. Designers must carefully balance these metrics while ensuring functional integrity and security.
  • Extensive Verification Requirements: Due to the sheer number of components and interactions, SoC verification is time-consuming and resource-intensive. Missed edge cases during verification can result in serious bugs post-silicon, affecting product reliability and safety.
  • Supply Chain Security Risks: Relying on global supply chains for IP, tools, and fabrication opens doors to tampering, IP theft, or counterfeit components. Ensuring the security and authenticity of every supply chain element is essential to prevent long-term risks.

3. Attack Surfaces in SoCs

Every interface, memory segment, and peripheral in an SoC is a potential attack vector. Below are key areas where attackers may target SoCs and why each one is important:

  • Hardware Interfaces (JTAG, UART): These are ports built into the chip to help developers test and debug the system during development. JTAG and UART can give deep access to the chip’s internal functions. If these ports are not disabled or protected in the final product, attackers can use them to take control of the device, read sensitive data, or change how the chip works.

  • Firmware & Boot Process: Firmware is the first code that runs when a device powers on. If attackers can replace or modify the firmware, they can gain complete control over the system before any security checks are applied. Secure Boot helps protect against this by verifying that only trusted firmware can run, but if not properly implemented, it becomes a major vulnerability.

  • Shared Memory & Side-Channel Attacks: In an SoC, multiple parts (like the CPU, GPU, and peripherals) often share memory access. If one component can read what another is doing, sensitive information can be leaked. Additionally, side-channel attacks look at indirect clues like power usage or timing to guess what data is being processed—such as secret encryption keys—without needing direct access.

  • Untrusted IP Cores: SoCs often include third-party components, called IP cores, which may not be fully transparent or secure. If any of these cores contain bugs or malicious logic, they can become backdoors into the system. It’s difficult to inspect every third-party component, so they remain a big security risk.

  • On-Chip Networks (NoC): Inside an SoC, components communicate through internal networks known as NoC (Network-on-Chip). If attackers can tap into this network, they may be able to intercept or manipulate data being exchanged. Without proper isolation and access control, the NoC can become a path for attacks to spread across the chip.

  • External Connectivity (USB, Wi-Fi, etc.): Modern SoCs connect to the outside world through many interfaces. These include wired connections like USB and HDMI, or wireless ones like Wi-Fi and Bluetooth. These connections are useful but also provide entry points for attackers. For example, a malicious USB stick can compromise a device, or a vulnerability in the Wi-Fi stack can be exploited remotely.

  • Operating System Drivers & Kernel Modules: The software that talks to hardware—like device drivers and kernel modules—runs with high privileges. If this software has bugs, attackers can exploit them to gain control over the system. Since these components are essential to SoC operation, they must be carefully written and regularly updated.

  • Supply Chain Tampering: SoCs go through a long production process involving many different companies and tools. If someone tampers with the design, tools, or manufacturing process—intentionally or unintentionally—they can introduce hidden threats, such as hardware Trojans or counterfeit parts. These risks are hard to detect after the chip is made and can stay hidden for years.

  • Each of these areas must be secured through a combination of hardware protections, cryptographic measures, and good design practices.

Each must be secured through hardware controls, cryptographic protections, and physical design measures.

4. Understanding Side-Channel Attacks in SoCs

A side-channel attack is a unique and clever form of security threat in the world of System-on-Chip (SoC) design. Unlike traditional attacks that try to break into software through bugs or weaknesses in code, side-channel attacks take a completely different route. They focus on the tiny clues a chip unintentionally gives away while it is working—clues that are not part of its actual output.

Imagine a secure SoC performing encryption. It might seem safe because it uses strong algorithms like AES or RSA. But what if someone could measure how much power the chip uses while encrypting? Or, how long does it take to finish certain operations? Or even the small electromagnetic waves it emits? These are all examples of side channels—paths that leak sensitive information, even when the chip itself appears perfectly secure.

For example, when encrypting different data, the chip might consume slightly different amounts of power. By observing these small changes over many encryption operations, an attacker can start piecing together what’s going on inside. Eventually, they might be able to figure out the secret key used in the encryption. The same goes for timing attacks—if some operations take longer than others, depending on the data, that timing difference can leak secrets too.

Compared to other kinds of security threats, side-channel attacks are especially dangerous because they do not require breaking through software protections. A typical software attack might try to exploit a bug in the operating system or an app, but a side-channel attack just watches the physical behaviour of the chip. It doesn’t need to inject any code or trigger any alarms, making it very stealthy and hard to detect.

This makes side-channel attacks a serious concern in sensitive devices, like payment terminals, secure communications systems, or even smartphones. Since SoCs are tightly packed with many components, and often share memory or buses between blocks, the risk of leaking information through side channels becomes even higher.

To defend against such attacks, designers must go beyond writing secure software. They need to build hardware that avoids giving away these indirect clues. This includes techniques like using constant-time operations, adding random noise to power usage, shielding circuits from electromagnetic analysis, and isolating sensitive parts of the chip.

In summary, side-channel attacks are a kind of silent spy—they don’t break in, but they listen carefully. And in the world of SoCs, where everything is closely packed and highly optimised, listening is sometimes all it takes to uncover a secret.

5. Comparing Surface-Level Attacks and Side-Channel Attacks in SoCs

In the context of SoC (System-on-Chip) security, it’s important to understand the difference between the two major categories of attacks: surface-level attacks and side-channel attacks. Although both are threats to the system, they differ significantly in how they are carried out and what they target.

Surface-level attacks are more direct and usually involve exploiting a vulnerability in the SoC’s software or hardware interfaces. These could include bugs in the firmware, insecure boot processes, or exposed communication ports like JTAG or USB. For example, if an attacker finds a flaw in the way the firmware handles updates, they might upload a malicious version that gives them control over the device. Surface-level attacks often target areas that are already meant to interact with users or developers, but which haven’t been properly secured.

Side-channel attacks, on the other hand, are more subtle and indirect. Instead of targeting flaws in code or open interfaces, these attacks observe the physical behaviour of the chip—such as power consumption, timing, or electromagnetic emissions—to extract sensitive information. For example, by measuring how long it takes a chip to encrypt data, an attacker might infer secret encryption keys. These attacks are like digital eavesdropping, using clues the chip accidentally gives away.

The key difference lies in how the information is obtained. Surface-level attacks exploit weaknesses in what the chip does; side-channel attacks exploit how the chip does it. Surface-level attacks are usually easier to launch if software bugs or misconfigurations exist, while side-channel attacks require more effort, special equipment, and sometimes physical access—but they can bypass even well-written code.

Another difference is in detection. Surface-level attacks may leave traces in logs or cause visible errors, making them easier to detect. Side-channel attacks, being passive and stealthy, are much harder to notice and can go undetected for long periods.

In summary, both types of attacks are serious threats. Surface-level attacks are like picking a lock to get in; side-channel attacks are like listening through the walls to learn what’s inside. A secure SoC must defend against both.

Scroll to Top

Human Pose Detection & Classification

Some Buildings in a city

Features:

  • Suitable for real time detection on edge devices
  • Detects human pose / key points and recognizes movement / behavior
  • Light weight deep learning models with good accuracy and performance

Target Markets:

  • Patient Monitoring in Hospitals
  • Surveillance
  • Sports/Exercise Pose Estimation
  • Retail Analytics

OCR / Pattern Recognition

Some Buildings in a city

Use cases :

  • Analog dial reading
  • Digital meter reading
  • Label recognition
  • Document OCR

Highlights :

  • Configurable for text or pattern recognition
  • Simultaneous Analog and Digital Dial reading
  • Lightweight implementation

Behavior Monitoring

Some Buildings in a city

Use cases :

  • Fall Detection
  • Social Distancing

Highlights :

  • Can define region of interest to monitor
  • Multi-subject monitoring
  • Multi-camera monitoring
  • Alarm triggers

Attire & PPE Detection

Some Buildings in a city

Use cases :

  • PPE Checks
  • Disallowed attire checks

Use cases :

  • Non-intrusive adherence checks
  • Customizable attire checks
  • Post-deployment trainable

 

Request for Video





    Real Time Color Detection​

    Use cases :

    • Machine vision applications such as color sorter or food defect detection

    Highlights :

    • Color detection algorithm with real time performance
    • Detects as close to human vison as possible including color shade discrimination
    • GPGPU based algorithm on NVIDIA CUDA and Snapdragon Adreno GPU
    • Extremely low latency (a few 10s of milliseconds) for detection
    • Portable onto different hardware platforms

    Missing Artifact Detection

    Use cases :

    • Detection of missing components during various stages of manufacturing of industrial parts
    • Examples include : missing nuts and bolts, missing ridges, missing grooves on plastic and metal blocks

    Highlights :

    • Custom neural network and algorithms to achieve high accuracy and inference speed
    • Single-pass detection of many categories of missing artifacts
    • In-field trainable neural networks with dynamic addition of new artifact categories
    • Implementation using low cost cameras and not expensive machine-vision cameras
    • Learning via the use of minimal training sets
    • Options to implement the neural network on GPU or CPU based systems

    Real Time Manufacturing Line Inspection

    Use cases :

    • Detection of defects on the surface of manufactured goods (metal, plastic, glass, food, etc.)
    • Can be integrated into the overall automated QA infrastructure on an assembly line.

    Highlights :

    • Custom neural network and algorithms to achieve high accuracy and inference speed
    • Use of consumer or industrial grade cameras
    • Requires only a few hundred images during the training phase
    • Supports incremental training of the neural network with data augmentation
    • Allows implementation on low cost GPU or CPU based platforms

    Ground Based Infrastructure analytics

    Some Buildings in a city

    Use cases :

    • Rail tracks (public transport, mining, etc.)
    • Highways
    • Tunnels

    Highlights :

    • Analysis of video and images from 2D & 3D RGB camera sensors
    • Multi sensor support (X-ray, thermal, radar, etc.)
    • Detection of anomalies in peripheral areas of core infrastructure (Ex: vegetation or stones near rail tracks)

    Aerial Analytics

    Use cases :

    • Rail track defect detection
    • Tower defect detection: Structural analysis of Power
      transmission towers
    • infrastructure mapping

    Highlights :

    • Defect detection from a distance
    • Non-intrusive
    • Automatic video capture with perfectly centered ROI
    • No manual intervention is required by a pilot for
      camera positioning

    SANJAY JAYAKUMAR

    Co-founder & CEO

     

    Founder and Managing director of Ignitarium, Sanjay has been responsible for defining Ignitarium’s core values, which encompass the organisation’s approach towards clients, partners, and all internal stakeholders, and in establishing an innovation and value-driven organisational culture.

     

    Prior to founding Ignitarium in 2012, Sanjay spent the initial 22 years of his career with the VLSI and Systems Business unit at Wipro Technologies. In his formative years, Sanjay worked in diverse engineering roles in Electronic hardware design, ASIC design, and custom library development. Sanjay later handled a flagship – multi-million dollar, 600-engineer strong – Semiconductor & Embedded account owning complete Delivery and Business responsibility.

     

    Sanjay graduated in Electronics and Communication Engineering from College of Engineering, Trivandrum, and has a Postgraduate degree in Microelectronics from BITS Pilani.

     

    Request Free Demo




      RAMESH EMANI Board Member

      RAMESH EMANI

      Board Member

      Ramesh was the Founder and CEO of Insta Health Solutions, a software products company focused on providing complete hospital and clinic management solutions for hospitals and clinics in India, the Middle East, Southeast Asia, and Africa. He raised Series A funds from Inventus Capital and then subsequently sold the company to Practo Technologies, India. Post-sale, he held the role of SVP and Head of the Insta BU for 4 years. He has now retired from full-time employment and is working as a consultant and board member.

       

      Prior to Insta, Ramesh had a 25-year-long career at Wipro Technologies where he was the President of the $1B Telecom and Product Engineering Solutions business heading a team of 19,000 people with a truly global operations footprint. Among his other key roles at Wipro, he was a member of Wipro's Corporate Executive Council and was Chief Technology Officer.

       

      Ramesh is also an Independent Board Member of eMIDs Technologies, a $100M IT services company focused on the healthcare vertical with market presence in the US and India.

       

      Ramesh holds an M-Tech in Computer Science from IIT-Kanpur.

      ​Manoj Thandassery

      VP – Sales & Business Development

      Manoj Thandassery is responsible for the India business at Ignitarium. He has over 20 years of leadership and business experience in various industries including the IT and Product Engineering industry. He has held various responsibilities including Geo head at Sasken China, Portfolio head at Wipro USA, and India & APAC Director of Sales at Emeritus. He has led large multi-country teams of up to 350 employees. Manoj was also an entrepreneur and has successfully launched and scaled, via multiple VC-led investment rounds, an Edtech business in the K12 space that was subsequently sold to a global Edtech giant.
      An XLRI alumnus, Manoj divides his time between Pune and Bangalore.

       

      MALAVIKA GARIMELLA​

      General Manager - Marketing

      A professional with a 14-year track record in technology marketing, Malavika heads marketing in Ignitarium. Responsible for all branding, positioning and promotional initiatives in the company, she has collaborated with technical and business teams to further strengthen Ignitarium's positioning as a key E R&D services player in the ecosystem.

      Prior to Ignitarium, Malavika has worked in with multiple global tech startups and IT consulting companies as a marketing consultant. Earlier, she headed marketing for the Semiconductor & Systems BU at Wipro Technologies and worked at IBM in their application software division.

      Malavika completed her MBA in Marketing from SCMHRD, Pune, and holds a B.E. degree in Telecommunications from RVCE, Bengaluru.

       

      PRADEEP KUMAR LAKSHMANAN

      VP - Operations

      Pradeep comes with an overall experience of 26 years across IT services and Academia. In his previous role at Virtusa, he played the role of Delivery Leader for the Middle East geography. He has handled complex delivery projects including the transition of large engagements, account management, and setting up new delivery centers.

      Pradeep graduated in Industrial Engineering and Management, went on to secure an MBA from CUSAT, and cleared UGN Net in Management. He also had teaching stints at his alma mater, CUSAT, and other management institutes like DCSMAT. A certified P3O (Portfolio, Program & Project Management) from the Office of Government Commerce, UK, Pradeep has been recognized for key contributions in the Management domain, at his previous organizations, Wipro & Virtusa.

      In his role as the Head of Operations at Ignitarium, Pradeep leads and manages operational functions such as Resource Management, Procurement, Facilities, IT Infrastructure, and Program Management office.

       

      SONA MATHEW Director – Human Resources

      SONA MATHEW

      AVP – Human Resources

      Sona heads Human Resource functions - Employee Engagement, HR Operations and Learning & Development – at Ignitarium. Her expertise include deep and broad experience in strategic people initiatives, performance management, talent transformation, talent acquisition, people engagement & compliance in the Information Technology & Services industry.

       

      Prior to Ignitarium, Sona has had held diverse HR responsibilities at Litmus7, Cognizant and Wipro.

       

      Sona graduated in Commerce from St. Xaviers College and did her MBA in HR from PSG College of Technology.

       

      ASHWIN RAMACHANDRAN

      Vice President - Sales

      As VP of Sales, Ashwin is responsible for Ignitarium’s go-to-market strategy, business, client relationships, and customer success in the Americas. He brings in over a couple of decades of experience, mainly in the product engineering space with customers from a wide spectrum of industries, especially in the Hi-Tech/semiconductor and telecom verticals.

       

      Ashwin has worked with the likes of Wipro, GlobalLogic, and Mastek, wherein unconventional and creative business models were used to bring in non-linear revenue. He has strategically diversified, de-risked, and grown his portfolios during his sales career.

       

      Ashwin strongly believes in the customer-first approach and works to add value and enhance the experiences of our customers.

       

      AZIF SALY Director – Sales

      AZIF SALY

      Vice President – Sales & Business Development

      Azif is responsible for go-to-market strategy, business development and sales at Ignitarium. Azif has over 14 years of cross-functional experience in the semiconductor product & service spaces and has held senior positions in global client management, strategic account management and business development. An IIM-K alumnus, he has been associated with Wipro, Nokia and Sankalp in the past.

       

      Azif handled key accounts and sales process initiatives at Sankalp Semiconductors. Azif has pursued entrepreneurial interests in the past and was associated with multiple start-ups in various executive roles. His start-up was successful in raising seed funds from Nokia, India. During his tenure at Nokia, he played a key role in driving product evangelism and customer success functions for the multimedia division.

       

      At Wipro, he was involved in customer engagement with global customers in APAC and US.

       

      RAJU KUNNATH Vice President – Enterprise & Mobility

      RAJU KUNNATH

      Distinguished Engineer – Digital

      At Ignitarium, Raju's charter is to architect world class Digital solutions at the confluence of Edge, Cloud and Analytics. Raju has over 25 years of experience in the field of Telecom, Mobility and Cloud. Prior to Ignitarium, he worked at Nokia India Pvt. Ltd. and Sasken Communication Technologies in various leadership positions and was responsible for the delivery of various developer platforms and products.

       

      Raju graduated in Electronics Engineering from Model Engineering College, Cochin and has an Executive Post Graduate Program (EPGP) in Strategy and Finance from IIM Kozhikode.

       

      PRADEEP SUKUMARAN Vice President – Business Strategy & Marketing

      PRADEEP SUKUMARAN

      Senior Vice President - Software Engineering

      Pradeep heads the Software Engineering division, with a charter to build and grow a world-beating delivery team. He is responsible for all the software functions, which includes embedded & automotive software, multimedia, and AI & Digital services

      At Ignitarium, he was previously part of the sales and marketing team with a special focus on generating a sales pipeline for Vision Intelligence products and services, working with worldwide field sales & partner ecosystems in the U.S  Europe, and APAC.

      Prior to joining Ignitarium in 2017, Pradeep was Senior Solutions Architect at Open-Silicon, an ASIC design house. At Open-Silicon, where he spent a good five years, Pradeep was responsible for Front-end, FPGA, and embedded SW business development, marketing & technical sales and also drove the IoT R&D roadmap. Pradeep started his professional career in 2000 at Sasken, where he worked for 11 years, primarily as an embedded multimedia expert, and then went on to lead the Multimedia software IP team.

      Pradeep is a graduate in Electronics & Communication from RVCE, Bangalore.

       

      SUJEET SREENIVASAN Vice President – Embedded

      SUJEET SREENIVASAN

      Senior Vice President – Automotive Technology

       

      Sujeet is responsible for driving innovation in Automotive software, identifying Automotive technology trends and advancements, evaluating their potential impact, and development of solutions to meet the needs of our Automotive customers.

      At Ignitarium, he was previously responsible for the growth and P&L of the Embedded Business unit focusing on Multimedia, Automotive, and Platform software.

      Prior to joining Ignitarium in 2016, Sujeet has had a career spanning more than 16 years at Wipro. During this stint, he has played diverse roles from Solution Architect to Presales Lead covering various domains. His technical expertise lies in the areas of Telecom, Embedded Systems, Wireless, Networking, SoC modeling, and Automotive. He has been honored as a Distinguished Member of the Technical Staff at Wipro and has multiple patents granted in the areas of Networking and IoT Security.

      Sujeet holds a degree in Computer Science from Government Engineering College, Thrissur.

       

      RAJIN RAVIMONY Distinguished Engineer

      RAJIN RAVIMONY

      Distinguished Engineer

       

      At Ignitarium, Rajin plays the role of Distinguished Engineer for complex SoCs and systems. He's an expert in ARM-based designs having architected more than a dozen SoCs and played hands-on design roles in several tens more. His core areas of specialization include security and functional safety architecture (IEC61508 and ISO26262) of automotive systems, RTL implementation of math intensive signal processing blocks as well as design of video processing and related multimedia blocks.

       

      Prior to Ignitarium, Rajin worked at Wipro Technologies for 14 years where he held roles of architect and consultant for several VLSI designs in the automotive and consumer domains.

       

      Rajin holds an MS in Micro-electronics from BITS Pilani.

       

      SIBY ABRAHAM Executive Vice President, Strategy

      SIBY ABRAHAM

      Executive Vice President, Strategy

       

      As EVP, of Strategy at Ignitarium, Siby anchors multiple functions spanning investor community relations, business growth, technology initiatives as well and operational excellence.

       

      Siby has over 31 years of experience in the semiconductor industry. In his last role at Wipro Technologies, he headed the Semiconductor Industry Practice Group where he was responsible for business growth and engineering delivery for all of Wipro’s semiconductor customers. Prior to that, he held a vast array of crucial roles at Wipro including Chief Technologist & Vice President, CTO Office, Global Delivery Head for Product Engineering Services, Business Head of Semiconductor & Consumer Electronics, and Head of Unified Competency Framework. He was instrumental in growing Wipro’s semiconductor business to over $100 million within 5 years and turning around its Consumer Electronics business in less than 2 years. In addition, he was the Engineering Manager for Enthink Inc., a semiconductor IP-focused subsidiary of Wipro. Prior to that, Siby was the Technical Lead for several of the most prestigious system engineering projects executed by Wipro R&D.

       

      Siby has held a host of deeply impactful positions, which included representing Wipro in various World Economic Forum working groups on Industrial IOT and as a member of IEEE’s IOT Steering Committee.

       

      He completed his MTech. in Electrical Engineering (Information and Control) from IIT, Kanpur and his BTech. from NIT, Calicut

       

      SUDIP NANDY

      Board Member

       

      An accomplished leader with over 40 years of experience, Sudip has helped build and grow companies in India, the US and the UK.

      He has held the post of Independent Director and Board Member for several organizations like Redington Limited, Excelra, Artison Agrotech, GeBBS Healthcare Solutions, Liquid Hub Inc. and ResultsCX.

      Most recently, Sudip was a Senior Advisor at ChrysCapital, a private equity firm where he has also been the Managing Director and Operating Partner for IT for the past 5 years. During his tenure, he has been Executive Chairman of California-headquartered Infogain Corporation and the non-Exec Chair on the board of a pioneering electric-2-wheeler company Ampere Vehicles, which is now a brand of Greaves Cotton Ltd.

      Earlier on in his career, Sudip has been the CEO and then Chairman India for Aricent. Prior to that, he had spent 25+ years in Wipro where he has been the Head of US business, Engineering R&D Services, and later the Head of EU Operations.

      Sudip is an active investor in several interesting startups in India and overseas, which mostly use technology for the social good, encompassing hyperlocal, healthcare, rural development, farmer support and e2W ecosystem. He also spends time as a coach and mentor for several CEOs in this role.

       

      SUJEETH JOSEPH Chief Product Officer

      SUJEETH JOSEPH

      Chief Technology Officer

       

      As CTO, Sujeeth is responsible for defining the technology roadmap, driving IP & solution development, and transitioning these technology components into practically deployable product engineering use cases.

       

      With a career spanning over 30+ years, Sujeeth Joseph is a semiconductor industry veteran in the SoC, System and Product architecture space. At SanDisk India, he was Director of Architecture for the USD $2B Removable Products Group. Simultaneously, he also headed the SanDisk India Patenting function, the Retail Competitive Analysis Group and drove academic research programs with premier Indian academic Institutes. Prior to SanDisk, he was Chief Architect of the Semiconductor & Systems BU (SnS) of Wipro Technologies. Over a 19-year career at Wipro, he has played hands-on and leadership roles across all phases of the ASIC and System design flow.

       

      He graduated in Electronics Engineering from Bombay University in 1991.

       

      SUJITH MATHEW IYPE Co-founder & CTO

      SUJITH MATHEW IYPE

      Co-founder & COO

       

      As Ignitarium's Co-founder and COO, Sujith is responsible for driving the operational efficiency and streamlining process across the organization. He is also responsible for the growth and P&L of the Semiconductor Business Unit.

       

      Apart from establishing a compelling story in VLSI, Sujith was responsible for Ignitarium's foray into nascent technology areas like AI, ML, Computer Vision, and IoT, nurturing them in our R&D Lab - "The Crucible".

       

      Prior to founding Ignitarium, Sujith played the role of a VLSI architect at Wipro Technologies for 13 years. In true hands-on mode, he has built ASICs and FPGAs for the Multimedia, Telecommunication, and Healthcare domains and has provided technical leadership for many flagship projects executed by Wipro.

       

      Sujith graduated from NIT - Calicut in the year 2000 in Electronics and Communications Engineering and thereafter he has successfully completed a one-year executive program in Business Management from IIM Calcutta.

       

      RAMESH SHANMUGHAM Co-founder & COO

      RAMESH SHANMUGHAM

      Co-founder & CRO

      As Co-founder and Chief Revenue Officer of Ignitarium, Ramesh has been responsible for global business and marketing as well as building trusted customer relationships upholding the company's core values.

      Ramesh has over 25 years of experience in the Semiconductor Industry covering all aspects of IC design. Prior to Ignitarium, Ramesh was a key member of the senior management team of the semiconductor division at Wipro Technologies. Ramesh has played key roles in Semiconductor Delivery and Pre-sales at a global level.

      Ramesh graduated in Electronics Engineering from Model Engineering College, Cochin, and has a Postgraduate degree in Microelectronics from BITS Pilani.